We are pleased to announce that our company will be exhibiting at ICEP 2025 (2025 International Conference on Electronic Packaging and iMAPS All Asia Conference), which will be held from April 15 (Tue) to April 18 (Fri), 2025 at the Wakasato Municipal Cultural Hall in Nagano City.

ICEP is Japan’s largest international conference on electronic packaging, attracting more than 360 attendees and hosting about 35 technical sessions.

At our booth, we will showcase our latest technological solutions tailored for advanced electronic packaging applications.

Our technical staff will be present throughout the exhibition to answer questions and provide detailed explanations.
We warmly invite you to visit our booth and look forward to seeing you at the event.

• Fine patterning and Plating on TGV by GWC process
• Glass substrate by GWC process

Exhibition Poster

Exhibition Name: ICEP-IAAC 2025
Dates: April 15 (Tue) – 18 (Fri), 2025
Venue: Wakasato Municipal Cultural Hall, Nagano Prefecture, Japan
Organizer: JIEP (The Japan Institute of Electronics Packaging)

Official Website：https://www.jiep.or.jp/icep/
Access to the Venue：https://www.jiep.or.jp/icep/location.html