An article on Koto Electric Co., Ltd.’s “All-Wet Cu Direct Plating Method on GWC Glass” will be featured in the special edition on electronic components in the October 2024 issue of Electronics Packaging Technology.

■Article Title

Trends in Glass PKG Packaging Technology – Application to Advanced Electronic Components and the Latest Cu Direct Plating GWC Technology

■Issue

October 2024 Issue (Published on September 20, 2024)

■Feature Section

Electronic Components Special Feature

■Electronics Packaging Technology Official Website

For more details, please check this page.

Cover reference: October 2024 Issue