In response to the development of communications technology, the design of electronic products is significantly changing. Along with that, various basic materials for electronic products are being developed and started to be used to satisfy diversified requirements. We are happy to serve our customers by forming a metal film on promising materials in the field of electronics.

Inorganic materials: Glass, Ceramics
Organic materials: ABS, Liquid crystal polymer, Cycloolefin polymer, Nylon, etc.

GWC：
The current method for forming metal films on glass substrates presents several challenges, such as weak adhesion strength, difficulty achieving uniform coating on three-dimensional molded objects, the need for surface roughening, and issues with heat resistance. Our newly developed processing technique, "GWC," is Koto Electric's proprietary metal coating formation process that significantly addresses these challenges. This wet method allows the formation of Cu (copper) coatings with strong adhesion on various types of glass without roughening the glass surface.

Adhesion strength：
By applying copper plating on various types of glass using the GWC process, the adhesion strength shown in the table below can be achieved. An adhesion strength of 0.8 kN/m or higher is obtained on alkali-free glass, making it suitable for adoption as a glass substrate. Furthermore, by forming a copper coating on quartz, it is expected to be used for high-frequency substrates.

TGV substrate with Cu plated coating coverage：
TGV have a variety of via shapes. The GWC process, utilizing a wet method, enables uniform copper deposition on vias regardless of their shape. It supports plating with an aspect ratio of up to 20.

Application to high-density TGV substrates：
This is an image of a TGV substrate observed using X-ray CT after copper plating. Copper can be uniformly deposited on high-density TGV substrates.

Fine line pattern：
It enables the formation of fine patterns without damaging the smooth surface of the glass. Additionally, the front and back patterns are securely connected through the TGV.

Plating on glass tubes：
Even on irregularly shaped materials such as glass tubes, it is possible to form conductive and reflective coatings on both the inner and outer surfaces.

Plating on extremely fine glass materials (powder)：
It is possible to apply a uniform conductive coating to powder materials with diameters ranging from a few micrometers to several tens of micrometers, such as resin and glass.

Plating of Ni/Sn, Ni/Au, Ni/Ag, etc. is available on the Ag-metallized (printed) ceramics.

Electronics components are being required to be downsized and multifunctional to cope with the development of smart phones, tablets, automobiles, and robots. It is also required to improve the production efficiency and quality stability of the electronics components. Koto has the technology to plate on minute parts as well as the proven barrel plating technology on small components. We are happy to receive small-lot prototype orders not to mention large quantity orders where we plate as many parts as possible at one time.

In addition to the above types of plating, solder plating and Ag plating are available. We are happy to suggest you the best plating options to respond to your requirements.

Our equipment and plating line can handle your requirements from beaker testing for a small amount of sample material to plating on a large material.

List of Equipment and Facility
Film hardness tester / Adhesion strength tester / Particle counter / Pilot line / Inductively Coupled Plasma Optical Emission Spectrometer (ICP-OES) / Scanning Electron Microscope (SEM) / Digital microscope / High Accelerated Stress Test (HAST) chamber / Solder checker / X-ray fluorescence film thickness meter / He leak detector / Cyclic Voltammetry Stripping (CVS) analyzer / Spectrophotometer / High power UV irradiation equipment / Box furnace